>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000HAYWIRE>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME0100001000>NAME01000>NAME01000>VALUE01000>NAME01000>NAME>VALUE01000>NAME>VALUE01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME0100001000>NAME01000>NAME01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME>VALUE01000>NAME>VALUE101000>NAME>VALUE101000>NAME>VALUE01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME>NAME>NAME01000>NAMELAPLAP01000>NAMELAPLAP>VALUE01000>NAME>VALUE01000>NAME>NAME>NAME>NAME>NAME>NAME01000>NAME01000>NAME>NAME>NAME>NAMEPICK&PLACE
ZERO POINTPICK&PLACE
ZERO POINTPICK
PLACE
ZERO
POINTPICK
PLACE
ZERO
POINTPWA RELEASED ASASSEMBLE PER BOM>D_SERIES>D_NUMBER>D_BRD_REV__.DigiKey.csvPICK & PLACE FILE>D_SERIES>D_NUMBER>D_BRD_REV__.pck_plc.txtREFERENCE VIEW, TOP>D_SERIES>D_NUMBER>D_BRD_REV___top.pdfREF. VIEW, BOTTOM>D_SERIES>D_NUMBER>D_BRD_REV___bot.pdf>D_REV->D_SERIES->D_NUMBER_PWAPADS ARE TYPICALLY OPTIMIZED FOR HAND
SOLDERING. THERE WILL BE ADDITIONAL
COPPER EXTENDING BEYOND THE END OF
THE DEVICE. THIS ADDITIONAL PAD AREA
PROVIDES CONTACT AREA FOR THE
SOLDERING IRON TIPPWA RELEASED AS>D_REV->D_SERIES->D_NUMBER_PWAFABRICATE TO IPC 6102D CLASS 2PARTS SUBSTITUTIONS TO BE
PROCESSED THROUGH
VENDOR SUPPLIED WEB
INTERFACEEXCELLON DRILL FILE>D_SERIES>D_NUMBER>D_BRD_REV__.drillGERBER FILE STANDARDS INFORMATION
UNITS INCHES
TOOL UNITS INCHES
COORDIANTES ABSOLUTE
NUMBER FOMRAT 2.4SURFACE FINISH HASLHOLE PLATING GUIDELINE
HOLES WITH ANNULAR RING
ARE TO BE PLATED
HOLES WITHOUT AN ANNULAR RING
ARE NOT TO BE PLATEDPWB RELEASED AS>D_BRD_REV->D_SERIES->D_NUMBER_PWBNOMINAL BOARD THICKNESS IS 0.062
INCH UNLESS SPECIFIED DIFFERENTLYPWB RELEASED AS>D_BRD_REV->D_SERIES->D_NUMBER_PWBHOLE FILL GUIDELINE
HOLES DRILLED 0.025" AND
SMALLER ARE TO BE FILLED
HOLES DRILLED 0.0255" AND
LARGER ARE NOT FILLED..XLNDate:>LAST_DATE_TIMEREV:TITLE:Series>DRAWING_NAMENumber>D_SERIES>D_NUMBER>D_BRD_REVCAGE2D354>D_TITLEThe University of Iowa
Department of Physics & Astronomy
Iowa City, IA, USA>D_PROJECTLAYERS>D_LAYERS>D_RELEASEPWAPWBApproval 1DesignedDrawnDateDateDatePlot:>LAST_DATE_TIMEREV:TITLE:Series>DRAWING_NAMENumber>D_SERIES>D_NUMBER>D_BRD_REVCAGE2D354>D_TITLE>D_DRAWN>D_DESIGNEDThe University of Iowa
Department of Physics & Astronomy
Iowa City, IA, USASave:>PLOT_DATE_TIME>D_PROJECTLAYERS>D_LAYERS>D_RELEASEPWAPWB>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME01000<b>TO-220</b>>NAME>VALUE<b>Small Outline Transistor 223</b><p>
PLASTIC PACKAGE CASE 318E-04<br>
Source: http://www.onsemi.co.jp .. LM137M-D.PDF>NAME>NAME>VALUE01000>NAME>NAME>VALUE>NAME>VALUE>NAME>NAME>NAME>NAME>VALUE>NAME0100DSG>VALUE>NAME0100IR>NAME>VALUE>NAME0100DSGDGS>VALUE>NAME0100DSGDSG>VALUE>NAME0100GSD>VALUE>NAME0100>VALUE>NAME0100GSD>NAME>VALUE>NAME0100GSD>NAME>NAME>NAME>NAME>VALUE>NAME>VALUE>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME>NAME01000>VALUE01000>NAME01000>NAME>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>VALUE01000>NAME>VALUE01000>NAME>NAME01000>NAME>VALUE01000>NAME01000>NAME>VALUE01000>NAME01000>NAME01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME01000>NAME>VALUE01000RH>NAME>NAME>NAME>NAME>NAME>NAME>NAME>VALUE01000>NAME0100001000>NAME0100001000>NAME01000>NAME>VALUE01000>NAME>VALUE01000>NAME>VALUE01000>NAME>NAME>NAME>NAME>NAME>NAME>NAME>VALUE0100001000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME>VALUE01000>NAME>VALUE01000>NAME0100001000>VALUE01000>NAME>NAME0100001000>NAME01000>NAME0100001000>NAME0100001000>NAME>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME0100001000>NAME01000>NAME01000>NAME>NAME>NAME>NAME>NAME>NAME01000>NAME01000>NAME01000>NAME01000>NAME>NAME>NAME>NAME01000>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME>NAME01000>NAME>NAME>NAME>NAME>NAME>NAME01000>NAME01000>NAME01000>NAME>NAME>NAME01000>NAME01000>NAME01000>NAME>NAME01000>NAME01000>NAME01000>NAME>VALUE>NAME>NAME>VALUE>NAME>VALUE>NAME>VALUE>NAME>VALUE>NAME>NAME>NAME>NAME>NAME>NAME>VALUE101000>NAME>VALUE01000>NAME01000>NAME>VALUE101000>NAME>VALUE101000>NAME>VALUE101000>NAME>VALUE101000>NAME101000>NAME>VALUE101000>NAME>VALUE101000>NAME101000>NAME101000>NAME01000CONNECTOR, HOUSING>VALUE>NAMECONN
HSG.CONNECTOR, PIN>VALUE>NAMECONN
PINUNIV of IOWA2D354>D_SERIES>D_NUMBER>D_BRD_REV>D_TITLE>DRAWING_NAMEC>D_DESIGNED2D354>D_SERIES>D_NUMBER>D_BRD_REV>D_TITLE>DRAWING_NAMEC>PLOT_DATE_TIME2D354>D_SERIES>D_NUMBER_PWA>D_TITLEASSEMBLY DRWG<b>SMALL OUTLINE TRANSISTOR</b><p>
wave soldering>NAME01000>NAME01000<b>Dual In Line Package</b>>NAME>NAME>VALUE101000>NAME01000BDesignedDrawnDateDateDate:Sheet:>SHEETRevTITLE:Series>DRAWING_NAMENumber>D_SERIES>D_NUMBER>D_REVCAGE2D354>D_TITLE>D_DRAWN>D_DESIGNEDThe University of Iowa
Department of Physics & Astronomy
Iowa City, IA, USA>D_DR_DT>D_DS_DT>D_PROJECT>D_VARIANT>LAST_DATE_TIME>PLOT_DATE_TIME>D_RELEASE Proprietary and Confidential Notice
Contents are (C) Copyright 2017 of The University of Iowa
PORTIONS OF THIS DOCUMENT AND ANY ACCOMPANYING ARTICLES MAY BE COVERED
BY ITAR (CFR22 PART 121) AND MAY NOT BE DISSEMINATED OR DISCLOSED.
Unauthorized duplication, distribution or use not permitted without prior
written consent. >NAME>VALUE>NAME>VALUE1VCC>VALUE>NAME>NAME>VALUE>NAME>VALUEPOS>NAME>VALUEPolarized Capacitors>NAME>VALUE>NAME>VALUE>VALUE>NAMEMARK ZERO POINT FOR
PICK & PLACE FILE ON
PRINTED CIRCUIT BOARD>D_SERIES>D_NUMBER_PWA>D_REV2D354PWA RELEASED AS-->D_SERIES>D_NUMBER_PWB>D_REV2D354PWB RELEASED AS--DRAWING FRAME SHOWN ON CIRCUIT BOARDBOT_COMPACTDRAWING FRAME SHOWN ON CIRCUIT BOARDTOP_FULL>NAME>VALUE12>NAME>VALUE34>NAME>VALUE>NAME>VALUE>NAME>VALUEV12.0>VALUE>NAME>VALUE>NAME>NAME>VALUE>NAME>VALUEPHONE JACK>VALUE>NAMESLEEVETIPRINGMisc PAD>NAME>VALUE>NAME>VALUE>VALUE>NAMEHARDWARE, HOUSING>NAME>VALUEHARDWARE, CONTACT>NAME>VALUEDRAWING FRAME SHOWN ON CIRCUIT BOARDBOARD-IDTHIS BOARD CONTAINS
STATIC SENSITIVE
DEVICES. HANDLE
ONLY IN STATIC SAFE
ENVIRONMENTDRAWING FRAME SHOWN ON CIRCUIT BOARDBOARD ASSY>NAME>VALUE>VALUE>NAMEDRAWING FRAMERESISTORUNIVERSITY OF IOWA LOGONon Polarized CapacitorGROUND PRIMARYPAD ARRAYANDDIODEPolarized CapacitorPICK AND PLACE FIDUCIALDWAWING FRAMEPCB TITLE BLOCK BOTPCB TITLE BLOCK TOPRESISTORRESISTORPOTENTIOMETERVOLTAGE REGULATORMOSFET NMOSFET PSCHOTTKY DIODEINDUCTORAUDIO JACKPAD 1PAD 2PAD ARRAYHARDWARE, HOUSINGHARDWARE, CONTACTPCB TITLE BLOCK BOARD IDESD LOGOBOARD ASSEMBLY NUNMBER INDICATOROperational Amplifier<b>Zilog Z80 Microprocessor Devices</b><p>
<author>Created by librarian@cadsoft.de</author>>NAME01000>NAME>VALUEPA0/T0IN/T0OUT/PA2/DE0/T1OUT/DBG/PA0>NAMERESET/PA2T0OUT/ANA3
VREF/CLKINCTS0/ANA2
COUT/T1INRXD0/ANA1
CINNTXD0/T1OUT
ANAO/CINPZ8 ENCORE XP2.087
(53.00)4.862
(123.50)>NAME>VALUE0.485
(11.75)
CLEAR ABOVE
0.062 PCB2.087
(53.00)3.514
(89.52)>NAME>VALUEBATTERY AREA0.485
(11.75)
CLEAR ABOVE
0.062 PCB0.256
(6.5)0.886
(22.5)2.854
(72.5)1.831
(46.5)2.8345
(72.00)6.398
(162.50)>NAME>VALUE0.850
(21.6)
CLEAR ABOVE
0.062 PCB2.8345
(72.00)4.439
(112.75)>NAME>VALUE0.850
(21.6)
CLEAR ABOVE
0.062 PCB1.683
(42.75)2.598
(66.0)0.236
(6.0)>NAME>VALUE2.8345
(72.00)4.242
(107.75)0.850
(21.6)
CLEAR ABOVE
0.062 PCB1.486
(37.75)2.598
(66.0)0.236
(6.0)4.882
(124.0)>NAME>VALUE2.8345
(72.00)4.242
(107.75)0.850
(21.6)
CLEAR ABOVE
0.062 PCB1.486
(37.75)2.598
(66.0)0.236
(6.0)4.882
(124.0)>NAME>VALUE3.352
(85.13)0.896
(22.75)0.241
(6.12)4.291
(109.0)2.244
(57.00)1.122
(28.5)2.003
(50.88)OUTSIDE EDGEBATTERY COMPARTMENT EDGE>NAME>VALUE2.8345
(72.00)4.242
(107.75)0.850
(21.6)
CLEAR ABOVE
0.062 PCB1.486
(37.75)2.598
(66.0)0.236
(6.0)4.882
(124.0)>NAME>VALUE1.000
(25.4)1.967
(49.965).225
(5.715)0.236
(6.0)2.175
(55.245)1.2
(35.63)RFRFE95GNDGNDGNDGND5.157
(131.00)>NAME>VALUE1.004
(25.5)4.154
(25.5)4.921
(125.0)2.559
(65.0)0.197
(5.0)5.531
(140.5)2.97
(75.5)
TO EDGE2.579
(65.5)3.799
(96.60)5.512
(140.00)>NAME>VALUE1.230
(31.25)
CLEAR ABOVE
0.062 PCB>NAME>VALUEHAMMOND 1599 Ehttp://www.digikey.com
00.34 P14-8RHT6-M CONN RING 14-18 (PANDUIT)MASTER OUT
REMOTE
DIM
CONTROLSLAVE IN
REMOTE
DIM
CONTROLVIA4Kx8 FLASH
1Kx8 SRAM
5MHzBLUE/ORANGEBLUEBLACKVERTICAL 10-TURN POT
FITS USING VIA
BOURNS 3266W-502LF-ND28mOhm DMP6023LE125mOhm ZXMP6A17GTASTANDALONE:J3S CONNECTS LEVEL/U4 TO U5/U1
(OR INSTALL 0 OHM AT R16)
DIM CONTROL LOCALMASTER:J3S CONNECTS LEVEL/U4 TO U5/U1
DIM CONTROL LOCALSLAVE:J3S ISOLATES LEVEL/U4 FROM U5/U1
DIM CONTYROL REMOTE
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.